The LH6 Kit for DB4 was designed to expand the CPU cooling from a single side panel to two side panels. It comprises of heat pipes, heak sink connectors, universal brackets and thermal pads/paste. When assembled correctly and with the appropriate environmental conditions, the total cooling performance can reach 105W* of heat dissipation. Whilst the stock DB4 heat pipes have been designed to work with virtually any motherboard layout, the LH6 will require a compatible CPU location and motherboard, see our system build guide for more details.

For full information, please visit the main product page here - https://streacom.com/products/db4-cpu-cooling-expansion-kit/